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High Thermal Conductivity Epoxy Potting Compound Epoxy Encapsulant for Motor Stators and Electronic Components

VS-EPTS1501 epoxy potting compound is suitable for electrical and electronic assemblies that require thermal conductivity, insulation, and protection.

  • Motor Stator Encapsulation: For motor stators requiring thermal management and resistance to temperature fluctuations.

  • High-Frequency Transformers: For encapsulating transformer components that require electrical insulation and heat dissipation.

  • Electrical and Electronic Modules: For potting applications where thermal conductivity, mechanical strength, and electrical insulation are important.

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  • VS-EPTS1501

  • VOLSUN

VS-EPTS1501 Epoxy Potting Compound

High Thermal Conductivity Epoxy Encapsulant for Electrical and Electronic Components

VS-EPTS1501 is a two-component, solvent-free, heat-curing epoxy potting compound designed for electrical and electronic components that require high thermal conductivity, excellent heat resistance, and reliable thermal shock resistance. It is particularly suitable for encapsulating motor stators, high-frequency transformers, and other components exposed to demanding thermal conditions.

With a thermal conductivity of 1.55 W/(m·K), excellent electrical insulation properties, and a UL 94 V-0 flame retardancy rating at 6 mm thickness, VS-EPTS1501 provides a combination of thermal management, electrical insulation, and mechanical protection for electronic and electrical assemblies.

epoxypotting (3).jpg

Key Features and Benefits

  • High Thermal Conductivity

With a thermal conductivity of 1.55 W/(m·K), VS-EPTS1501 helps transfer heat away from potted components, supporting thermal management in electrical and electronic equipment.

  • Excellent Thermal Shock Resistance

Designed to withstand thermal shock over a temperature range of -40°C to +180°C, making it suitable for components exposed to temperature fluctuations.

  • Excellent Heat Resistance

Its heat-resistant epoxy system is designed for demanding thermal environments, including motor and transformer encapsulation applications.

  • Good Wettability

The compound offers excellent wettability to support contact with component surfaces during the potting process.

  • Electrical Insulation Performance

The cured material features a dielectric breakdown strength of 24 kV/mm and a volume resistivity of 7.2 × 10¹⁵ Ω·cm at 23°C.

Resistance to Transmission Fluid

The formulation offers excellent resistance to transmission fluid, supporting applications where contact with this type of fluid is a consideration.

Technical Specifications

Component Properties

Property

Component A

Component B

Product name

Epoxy Resin 1501A

Hardener 1501B

Main component

Epoxy resin

Modified acid anhydride

Appearance

Grayish-black paste

White paste

Viscosity at 25°C

300,000 cps

100,000 cps

Viscosity at 80°C

1,900 cps

3,500 cps

Specific gravity at 25°C

2.615 g/cm³

2.352 g/cm³

Mixing and Processing Properties

Property

Specification

Mixing ratio by weight (A)

100:75

Mixed viscosity at 80°C

2,500 cps

Gelation time at 90°C

52 minutes

Gelation time at 110°C

19 minutes

Viscosity doubling time at 80°C

24 minutes

Time to reach 10,000 cps at 80°C

45 minutes

Recommended curing conditions

95°C for 2 hours + 120°C for 3 hours, or 130°C for 3 hours

Select the appropriate curing conditions according to the actual manufacturing process and component requirements.

Cured Material Properties

Property

Test Standard

Typical Value

Hardness

ISO 868

Shore D 92

Glass transition temperature (Tg)

IEC 1006

91°C

Tensile strength

ISO 527

66 MPa

Elongation at break

ISO 527

0.8%

Tensile modulus

ISO 527

25 GPa

Flexural strength

ISO 178

118 MPa

Flexural modulus

ISO 178

14 GPa

Impact strength

ISO 179-93

13 kJ/m²

Linear thermal expansion coefficient below Tg

ISO 11359-2

32 ppm/K

Linear thermal expansion coefficient above Tg

ISO 11359-2

96 ppm/K

Tensile shear strength (Fe/Fe)

GB/T 7124-2008

27 MPa

Thermal conductivity

ISO 8894-1

1.55 W/(m·K)

Water absorption, 25°C/7 days

ISO 62

0.05%

Water absorption, 100°C/120 minutes

ISO 62

0.05%

Dielectric breakdown strength at 23°C

IEC 60243-1

24 kV/mm

Volume resistivity at 23°C

IEC 62631

7.2 × 10¹⁵ Ω·cm

Comparative tracking index (CTI)

IEC 60112

>600

Flame retardancy at 6 mm

UL 94

V-0

Note: Values are based on laboratory testing under the conditions stated in the product specification. Actual performance may vary with processing conditions, component design, and application environment.

epoxypotting (2).jpg

Processing Instructions

For optimal processing, preheat Components A and B separately at 80°C for 1 hour before use, according to the manufacturer's laboratory recommendations.

  1. Thoroughly mix each component in its original container to redistribute any settled fillers.

  2. Weigh Components A and B at a ratio of 100:75.

  3. Mix thoroughly and use vacuum equipment to remove entrapped air.

  4. Proceed with injection or potting. If bubbles are difficult to remove, an additional 10-minute preheating period may be used before vacuum degassing and injection.

  5. After preheating, use the components within 30 minutes to help maintain suitable wetting and processing performance.

  6. Cure according to the selected curing schedule and the requirements of the application.

Once Components A and B are mixed, use the compound as soon as possible. Keep unused components separately sealed and avoid cross-contamination.

Packaging and Storage

  • Product model: VS-EPTS1501

  • Package size: 32 L / 40 kg per set, as specified in the product datasheet.

  • Storage: Keep tightly sealed in the original packaging at room temperature and away from light.

  • Shelf life: 6 months from the date of manufacture.

  • Customization: Custom specifications and packaging are available upon request.

Why Choose Volsun Epoxy Potting Compounds?

Suzhou Volsun Electronics Technology Co., Ltd. specializes in functional insulation and thermal management materials for industrial and electronic applications.

We support customers with technical product selection and application-oriented solutions. For epoxy potting requirements, our team can help evaluate product suitability based on thermal performance, electrical insulation requirements, component geometry, curing conditions, and production processes.

Looking for a thermal conductive epoxy potting compound for motor stators or high-frequency transformers? Contact Volsun to discuss your application.

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