VS-EPTS1501 epoxy potting compound is suitable for electrical and electronic assemblies that require thermal conductivity, insulation, and protection.
Motor Stator Encapsulation: For motor stators requiring thermal management and resistance to temperature fluctuations.
High-Frequency Transformers: For encapsulating transformer components that require electrical insulation and heat dissipation.
Electrical and Electronic Modules: For potting applications where thermal conductivity, mechanical strength, and electrical insulation are important.
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VS-EPTS1501
VOLSUN
High Thermal Conductivity Epoxy Encapsulant for Electrical and Electronic Components
VS-EPTS1501 is a two-component, solvent-free, heat-curing epoxy potting compound designed for electrical and electronic components that require high thermal conductivity, excellent heat resistance, and reliable thermal shock resistance. It is particularly suitable for encapsulating motor stators, high-frequency transformers, and other components exposed to demanding thermal conditions.
With a thermal conductivity of 1.55 W/(m·K), excellent electrical insulation properties, and a UL 94 V-0 flame retardancy rating at 6 mm thickness, VS-EPTS1501 provides a combination of thermal management, electrical insulation, and mechanical protection for electronic and electrical assemblies.
High Thermal Conductivity
With a thermal conductivity of 1.55 W/(m·K), VS-EPTS1501 helps transfer heat away from potted components, supporting thermal management in electrical and electronic equipment.
Excellent Thermal Shock Resistance
Designed to withstand thermal shock over a temperature range of -40°C to +180°C, making it suitable for components exposed to temperature fluctuations.
Excellent Heat Resistance
Its heat-resistant epoxy system is designed for demanding thermal environments, including motor and transformer encapsulation applications.
Good Wettability
The compound offers excellent wettability to support contact with component surfaces during the potting process.
Electrical Insulation Performance
The cured material features a dielectric breakdown strength of 24 kV/mm and a volume resistivity of 7.2 × 10¹⁵ Ω·cm at 23°C.
Resistance to Transmission Fluid
The formulation offers excellent resistance to transmission fluid, supporting applications where contact with this type of fluid is a consideration.
Property | Component A | Component B |
|---|---|---|
Product name | Epoxy Resin 1501A | Hardener 1501B |
Main component | Epoxy resin | Modified acid anhydride |
Appearance | Grayish-black paste | White paste |
Viscosity at 25°C | 300,000 cps | 100,000 cps |
Viscosity at 80°C | 1,900 cps | 3,500 cps |
Specific gravity at 25°C | 2.615 g/cm³ | 2.352 g/cm³ |
Property | Specification |
|---|---|
Mixing ratio by weight (A) | 100:75 |
Mixed viscosity at 80°C | 2,500 cps |
Gelation time at 90°C | 52 minutes |
Gelation time at 110°C | 19 minutes |
Viscosity doubling time at 80°C | 24 minutes |
Time to reach 10,000 cps at 80°C | 45 minutes |
Recommended curing conditions | 95°C for 2 hours + 120°C for 3 hours, or 130°C for 3 hours |
Select the appropriate curing conditions according to the actual manufacturing process and component requirements.
Property | Test Standard | Typical Value |
|---|---|---|
Hardness | ISO 868 | Shore D 92 |
Glass transition temperature (Tg) | IEC 1006 | 91°C |
Tensile strength | ISO 527 | 66 MPa |
Elongation at break | ISO 527 | 0.8% |
Tensile modulus | ISO 527 | 25 GPa |
Flexural strength | ISO 178 | 118 MPa |
Flexural modulus | ISO 178 | 14 GPa |
Impact strength | ISO 179-93 | 13 kJ/m² |
Linear thermal expansion coefficient below Tg | ISO 11359-2 | 32 ppm/K |
Linear thermal expansion coefficient above Tg | ISO 11359-2 | 96 ppm/K |
Tensile shear strength (Fe/Fe) | GB/T 7124-2008 | 27 MPa |
Thermal conductivity | ISO 8894-1 | 1.55 W/(m·K) |
Water absorption, 25°C/7 days | ISO 62 | 0.05% |
Water absorption, 100°C/120 minutes | ISO 62 | 0.05% |
Dielectric breakdown strength at 23°C | IEC 60243-1 | 24 kV/mm |
Volume resistivity at 23°C | IEC 62631 | 7.2 × 10¹⁵ Ω·cm |
Comparative tracking index (CTI) | IEC 60112 | >600 |
Flame retardancy at 6 mm | UL 94 | V-0 |
Note: Values are based on laboratory testing under the conditions stated in the product specification. Actual performance may vary with processing conditions, component design, and application environment.
For optimal processing, preheat Components A and B separately at 80°C for 1 hour before use, according to the manufacturer's laboratory recommendations.
Thoroughly mix each component in its original container to redistribute any settled fillers.
Weigh Components A and B at a ratio of 100:75.
Mix thoroughly and use vacuum equipment to remove entrapped air.
Proceed with injection or potting. If bubbles are difficult to remove, an additional 10-minute preheating period may be used before vacuum degassing and injection.
After preheating, use the components within 30 minutes to help maintain suitable wetting and processing performance.
Cure according to the selected curing schedule and the requirements of the application.
Once Components A and B are mixed, use the compound as soon as possible. Keep unused components separately sealed and avoid cross-contamination.
Product model: VS-EPTS1501
Package size: 32 L / 40 kg per set, as specified in the product datasheet.
Storage: Keep tightly sealed in the original packaging at room temperature and away from light.
Shelf life: 6 months from the date of manufacture.
Customization: Custom specifications and packaging are available upon request.
Suzhou Volsun Electronics Technology Co., Ltd. specializes in functional insulation and thermal management materials for industrial and electronic applications.
We support customers with technical product selection and application-oriented solutions. For epoxy potting requirements, our team can help evaluate product suitability based on thermal performance, electrical insulation requirements, component geometry, curing conditions, and production processes.
Looking for a thermal conductive epoxy potting compound for motor stators or high-frequency transformers? Contact Volsun to discuss your application.