Volsun silicone thermally conductive potting compound has become a leader in the field of electronic packaging with its excellent performance. Its thermal conductivity ranges from 0.1-2.0W/m·K, which can efficiently transfer heat, effectively prevent electronic components from overheating, and ensure stable operation of the equipment.
At the same time, the silicone potting compound has excellent electrical insulation, high volume resistivity (≥1×10¹3Ω·cm) and high voltage breakdown resistance, providing solid protection for circuit safety.
In terms of temperature resistance, it can maintain performance in a wide range of operating temperatures from -40℃ to 200℃, adapting to various extreme environments. In addition, it has good fluidity and adjustable viscosity, making it easy to fill complex structures. The curing characteristics are flexible and can be cured at room temperature or by heating, to meet different needs. After curing, the silicone potting compound exhibits low elastic modulus and good flexibility, effectively resists shock and vibration, and reduces stress damage.
What is more worth mentioning is that this product complies with environmental protection standards such as RoHS and REACH, is solvent-free, and combines environmental protection and social responsibility.

Silicone thermal potting compound is a high-performance, two-component, 1:1 mixed ratio thermosetting material that can be cured at room temperature or under heating conditions to form a thermally conductive silicone rubber with excellent elasticity. This silicone potting compound is specially designed for the manufacture of electronic and electrical products and modules, and can provide all-round protection for various high-precision and high-demand electronic components.
Especially in the potting protection of key components such as high-power power modules, inverters, sensors, etc., silicone thermal potting compound has shown its unique advantages. It can not only effectively transfer heat and prevent components from overheating, but also provide excellent electrical insulation performance to ensure the safe operation of the circuit. In addition, its good fluidity and adjustable viscosity make it easy to fill complex structures and achieve seamless potting.
At the same time, this silicone potting compound is also widely used in the connection and fixation between automotive electronic devices and PCBs, providing them with stable support and protection, and effectively resisting external influences such as vibration and impact.

Silicone thermal potting compound can be classified according to a variety of standards to meet the needs of different application scenarios. It should be noted that these classification methods are not independent of each other, and a thermal potting compound can belong to multiple categories at the same time.
So, when choosing a suitable thermal potting compound, it is necessary to make a comprehensive consideration based on the specific application requirements and environmental conditions.

In the field of new energy vehicles, silicone thermally conductive potting compound plays an indispensable role. For battery packs, by injecting potting compound into the gap between modules or cells, not only the heat is evenly distributed, but also the safety and life of the battery are significantly improved. In the on-board charger (OBC), potting glue effectively improves the heat dissipation efficiency and ensures the temperature stability of the charger when it works efficiently. In addition, the motor controller reduces thermal resistance and improves heat dissipation efficiency through the application of potting glue, ensuring its stable operation in high temperature environments.

The LED lighting industry also benefits from the technical advantages of silicone thermally conductive potting compound. In high-power LED lamps, silicone potting compound not only effectively conducts heat and reduces chip temperature, but also improves light efficiency and life, and provides excellent waterproof and dustproof protection. For car lights, the application of potting compound not only meets the heat dissipation requirements, but also gives the car lights excellent waterproof and moisture-proof properties, ensuring its stability and long life in harsh weather conditions.

In the photovoltaic energy storage field, the application of silicone thermal potting compound provides an efficient thermal management solution for photovoltaic inverters and energy storage battery packs. For photovoltaic inverters, silicone potting compound effectively improves heat dissipation efficiency, reduces temperature rise, and extends equipment life. In energy storage battery packs, the application of silicone potting compound realizes effective heat management and ensures the temperature stability and safety of the battery pack during charging and discharging.

The silicone thermal conductive potting compound has shown excellent application value in both the power electronics and consumer electronics industries. In the field of power electronics, equipment such as transformers, mutual inductors and power modules have achieved effective heat dissipation and electrical insulation through the application of potting compounds, significantly extending the life of the equipment and ensuring its stable operation under high temperature and high load conditions. For example, in transformers, potting compounds not only have good heat dissipation, but also provide additional insulation protection; the power module has significantly reduced thermal resistance and improved heat dissipation efficiency due to the application of potting compounds. In the consumer electronics industry, high-end equipment such as 5G base stations, server power supplies and AI chips also benefit from the technical advantages of silicone thermal conductive potting compounds. For 5G base stations, potting compounds effectively dissipate heat and improve signal quality and coverage; server power supplies ensure stability and reliability during long-term, high-load operation through the application of potting compounds.