Suzhou Volsun Electronics Technology Co., Ltd.
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VS-TP1001
VOLSUN
VS-TP1001 Two Component Thermal Conductive Silicone Potting Compound
Item | Typical value | Test method |
Mixing ratio | 1:1 | / |
Color(After mixing) | Grey | Visual inspection |
Viscosity(Component A) @25℃ | 2500±500cps | ASTM D2196 |
Viscosity(Component B) @25℃ | 2500±500cps | ASTM D2196 |
Viscosity(After mixing) @25℃ | 2500±500cps | ASTM D2196 |
Opening hours@25℃ | ≥60min | / |
Curing condition | 30min/50℃；20min/100℃ | / |
Thermal conductivity | 1.0±0.2 W/m·k | ASTM D5470 |
Thermal resistance | 0.000815m2·k/W | ASTM D5470 |
hardness | 65±5 Shore A | GB/T 531.1-2008 |
density | 2.0±0.2 g/cm3 | GB/T 1033.1-2008 |
Tensile strength | ＞0.5 MPa | GB/T 528-2009 |
Elongation at break | ＞10% | GB/T 528-2009 |
Flame retardant rating | V-0 | UL94 |
Breakdown strength | ≥15 kV/mm | GB/T 1695-2005 |
Volume resistivity | ≥ 1.0×1014 Ω·cm | GB/T 1692-2008 |
Dielectric constant （1000Hz） | 3.9~4.6 | GB/T 1693-2007 |
Stir components A and B separately before mixing
Combine the well-stirred components A and B in a 1:1 ratio (either volume or weight)
Pour the mixed compound into the device to be filled and allow it to cure (can be cured at room temperature or with heat)
To ensure even distribution of fillers, it is essential to stir components A and B separately before mixing to achieve a uniform blend.
Once components A and B are mixed, they will undergo a reaction and cure process, making it crucial to use the mixture promptly without attempting to reuse it after curing.
Prior to pouring the mixture into the protective part, ensure the absence of large debris or contaminants to maintain optimal material adhesion.
During the curing process, avoid contact with external objects that could impact the material's appearance and protective properties until it is fully cured.
Avoid contact with eyes and mouth. In case of accidental exposure, rinse with clean water or seek medical attention.
Vacuum defoaming is necessary for achieving high thermal conductivity before pouring the mixture.
Note that curing time may be prolonged in low-temperature environments.
VS-TP1001 Two Component Thermal Conductive Silicone Potting Compound
Item | Typical value | Test method |
Mixing ratio | 1:1 | / |
Color(After mixing) | Grey | Visual inspection |
Viscosity(Component A) @25℃ | 2500±500cps | ASTM D2196 |
Viscosity(Component B) @25℃ | 2500±500cps | ASTM D2196 |
Viscosity(After mixing) @25℃ | 2500±500cps | ASTM D2196 |
Opening hours@25℃ | ≥60min | / |
Curing condition | 30min/50℃；20min/100℃ | / |
Thermal conductivity | 1.0±0.2 W/m·k | ASTM D5470 |
Thermal resistance | 0.000815m2·k/W | ASTM D5470 |
hardness | 65±5 Shore A | GB/T 531.1-2008 |
density | 2.0±0.2 g/cm3 | GB/T 1033.1-2008 |
Tensile strength | ＞0.5 MPa | GB/T 528-2009 |
Elongation at break | ＞10% | GB/T 528-2009 |
Flame retardant rating | V-0 | UL94 |
Breakdown strength | ≥15 kV/mm | GB/T 1695-2005 |
Volume resistivity | ≥ 1.0×1014 Ω·cm | GB/T 1692-2008 |
Dielectric constant （1000Hz） | 3.9~4.6 | GB/T 1693-2007 |
Stir components A and B separately before mixing
Combine the well-stirred components A and B in a 1:1 ratio (either volume or weight)
Pour the mixed compound into the device to be filled and allow it to cure (can be cured at room temperature or with heat)
To ensure even distribution of fillers, it is essential to stir components A and B separately before mixing to achieve a uniform blend.
Once components A and B are mixed, they will undergo a reaction and cure process, making it crucial to use the mixture promptly without attempting to reuse it after curing.
Prior to pouring the mixture into the protective part, ensure the absence of large debris or contaminants to maintain optimal material adhesion.
During the curing process, avoid contact with external objects that could impact the material's appearance and protective properties until it is fully cured.
Avoid contact with eyes and mouth. In case of accidental exposure, rinse with clean water or seek medical attention.
Vacuum defoaming is necessary for achieving high thermal conductivity before pouring the mixture.
Note that curing time may be prolonged in low-temperature environments.
