Suzhou Volsun Electronics Technology Co., Ltd.
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VS-GP2001
VOLSUN
VS-GP2001 silicone thermal pad is designed to offer efficient heat transfer with low interfacial thermal resistance, even at low pressures. It boasts excellent thermal conductivity, stability, flexibility, and resilience, ensuring a safe and reliable performance. This thermal pad is typically used between power devices and cooling aluminum sheets or machine shells. By effectively eliminating air gaps, it enables optimal thermal conductivity and fills voids to enhance heat dissipation.
Operating temperature: -40℃~+200℃
High thermal conductivity, low thermal resistance
Excellent surface wettability and resilience
Outstanding flame retardancy
Multiple thickness options and versatile application range
Comply with RoHS and REACH
Item | Typical Data | Test Standard |
Standard color | Gray | Visual |
Density (g/cm3) | 2.0 | GB/T 1033.1-2008 |
Thickness (mm) | 0.5~5.0 | ASTM D374 |
Hardness (Shore OO) | 30-70 | GB/T 531.1-2008 |
Tensile strength (KPa) | ≥100 | GB/T 528-2009 |
Elongation at break (%) | ≥25 | GB/T 528-2009 |
Thermal conductivity (W/m·k) | 2.0 | ASTM D5470 |
Flame Retardancy | V-0 | UL94 |
Dielectric Breakdown Voltage (kV) | 7kV/mm | ASTM D149 |
Volume resistivity | ≥1.0×10 12 Ω·cm | ASTM D257 |
Compressibility（%） | ＞50 | GB/T 20671.2-2006 |
Oil Penetration（%） | ≤2 | / |
Prior to use, ensure that the surface of the substrate to be installed is thoroughly cleaned.
Select products with specifications that correspond to the dimensions of the installation parts for optimal fit and performance
To ensure proper installation and maintain the protective performance of materials, the environment should be free of large debris or pollutants that may interfere with the installation process.
When selecting the product, it is important to choose specifications that closely match the dimensions of the installation site. The deviation should be kept minimal to ensure a proper fit and optimal performance.
Storage Temperature: 0℃~40℃
Relative humidity: RH＜80%
Shelf life: 12 months from the production date
Q1. What does a thermal pad do?
The purpose of thermal pads is to fill air gaps caused by imperfectly smooth or flat surfaces that need to be in close contact. In contrast, they aren't needed between perfectly flat or smooth surfaces. Heat will be conducted away by the thermal pad, preventing overheating and any potential damage.
Q2. Is it OK to touch thermal pads?
In practice, it won't make much difference if you touched them or not. The thermal performance is not going to be compromised by a molecule-thick layer of skin oils on the pad.
Q3. Where should I put thermal pads?
You can use thermal pads on MOSFETs, analog ICs, micro-controller units, heatsinks, LEDs, laptops, DVDs, high-temperature SMD components, chipsets, large PCB surfaces GPU cards, motherboards, add-on cards, and other densely packed electronic devices.
VS-GP2001 silicone thermal pad is designed to offer efficient heat transfer with low interfacial thermal resistance, even at low pressures. It boasts excellent thermal conductivity, stability, flexibility, and resilience, ensuring a safe and reliable performance. This thermal pad is typically used between power devices and cooling aluminum sheets or machine shells. By effectively eliminating air gaps, it enables optimal thermal conductivity and fills voids to enhance heat dissipation.
Operating temperature: -40℃~+200℃
High thermal conductivity, low thermal resistance
Excellent surface wettability and resilience
Outstanding flame retardancy
Multiple thickness options and versatile application range
Comply with RoHS and REACH
Item | Typical Data | Test Standard |
Standard color | Gray | Visual |
Density (g/cm3) | 2.0 | GB/T 1033.1-2008 |
Thickness (mm) | 0.5~5.0 | ASTM D374 |
Hardness (Shore OO) | 30-70 | GB/T 531.1-2008 |
Tensile strength (KPa) | ≥100 | GB/T 528-2009 |
Elongation at break (%) | ≥25 | GB/T 528-2009 |
Thermal conductivity (W/m·k) | 2.0 | ASTM D5470 |
Flame Retardancy | V-0 | UL94 |
Dielectric Breakdown Voltage (kV) | 7kV/mm | ASTM D149 |
Volume resistivity | ≥1.0×10 12 Ω·cm | ASTM D257 |
Compressibility（%） | ＞50 | GB/T 20671.2-2006 |
Oil Penetration（%） | ≤2 | / |
Prior to use, ensure that the surface of the substrate to be installed is thoroughly cleaned.
Select products with specifications that correspond to the dimensions of the installation parts for optimal fit and performance
To ensure proper installation and maintain the protective performance of materials, the environment should be free of large debris or pollutants that may interfere with the installation process.
When selecting the product, it is important to choose specifications that closely match the dimensions of the installation site. The deviation should be kept minimal to ensure a proper fit and optimal performance.
Storage Temperature: 0℃~40℃
Relative humidity: RH＜80%
Shelf life: 12 months from the production date
Q1. What does a thermal pad do?
The purpose of thermal pads is to fill air gaps caused by imperfectly smooth or flat surfaces that need to be in close contact. In contrast, they aren't needed between perfectly flat or smooth surfaces. Heat will be conducted away by the thermal pad, preventing overheating and any potential damage.
Q2. Is it OK to touch thermal pads?
In practice, it won't make much difference if you touched them or not. The thermal performance is not going to be compromised by a molecule-thick layer of skin oils on the pad.
Q3. Where should I put thermal pads?
You can use thermal pads on MOSFETs, analog ICs, micro-controller units, heatsinks, LEDs, laptops, DVDs, high-temperature SMD components, chipsets, large PCB surfaces GPU cards, motherboards, add-on cards, and other densely packed electronic devices.
