Suzhou Volsun Electronics Technology Co., Ltd.
| Quantity: | |
|---|---|
VS-TP2001
Volsun
VS-TP2001 Silicone Heat Conductive Potting Compound is designed for electronics protection. It provides excellent thermal conductivity for CPU and electronic devices. The silicone material ensures durability and flexibility in various applications. This product offers reliable performance for potting in sensitive electronic components.
The compound cures at room temperature or with heat. It is ideal for providing effective heat dissipation and moisture protection for electronic devices. Its low viscosity ensures smooth application in tight spaces and complex areas.
Item | Typical value | Test method |
Mixing ratio | 1:1 | / |
Color(After mixing) | Grey | Visual inspection |
Viscosity(Component A) @25℃ | 5500±500cps | ASTM D2196 |
Viscosity(Component B) @25℃ | 5500±500cps | ASTM D2196 |
Viscosity(After mixing) @25℃ | 5500±500cps | ASTM D2196 |
Opening hours@25℃ | ≥90min | / |
Curing condition | 30min/50℃；20min/100℃ | / |
Thermal conductivity | 2.0±0.2 W/m·k | ASTM D5470 |
Thermal resistance | 0.000815m2·k/W | ASTM D5470 |
hardness | 25±5 Shore A | GB/T 531.1-2008 |
density | 2.3±0.2 g/cm3 | GB/T 1033.1-2008 |
Tensile strength | ＞0.2 MPa | GB/T 528-2009 |
Elongation at break | ＞10% | GB/T 528-2009 |
Flame retardant rating | V-0 | UL94 |
Breakdown strength | ≥10 kV/mm | GB/T 1695-2005 |
Volume resistivity | ≥ 1.0×1014 Ω·cm | GB/T 1692-2008 |
Dielectric constant （1000Hz） | 4.7~5.5 | GB/T 1693-2007 |
Model | Packing |
VS-TP2001（1kg） | Component A 0.5kg; Component B 0.5kg |
VS-TP2001（20kg） | Component A 10kg; Component B 10kg |
VS-TP2001（40kg） | Component A 20kg; Component B 20kg |
VS-TP2001（80kg） | Component A 40kg; Component B 40kg |
VS-TP2001（100kg） | Component A 50kg; Component B 50kg |
Two-component system: This potting compound consists of two components that are mixed in a 1:1 ratio for easy use.
Room temperature or heat cure: Cures at room temperature or can be accelerated by heating for faster results.
High thermal conductivity: Designed to effectively dissipate heat and improve the performance of electronic devices.
Versatile protection: Provides protection for automotive components, providing physical strength and elasticity at high temperatures.
Excellent thermal shock resistance: Ensures reliable performance under extreme thermal cycling conditions.
Waterproof and flame retardant: Provides moisture protection and prevents fire, ensuring safety and durability.
Low viscosity: Allows easy application in small spaces and complex areas for precise potting.
Automotive Parts: For encapsulating automotive parts, providing physical protection and improving performance.
LED Lighting: Protects LED lighting modules, ensuring long-term reliability and heat dissipation.
Electronic Devices: Ideal for encapsulating sensitive electronic components, improving durability and stability.
Power Modules: For high-power power modules, ensuring safe and stable operation.
Inverters: Provides protective sealing for inverters, improving heat resistance and performance.
Sensors: Encapsulates sensors for enhanced protection from environmental factors.
What is the purpose of VS-TP2001 Thermal Silicone Potting Compound?
It is used to pot and protect electronic components such as automotive parts, LED lights, and other sensitive electronic devices.
What is the curing process of this potting compound?
The compound can be cured at room temperature or with heat. The higher the temperature, the shorter the curing time.
What are the main properties of the VS-TP2001 compound?
High thermal conductivity, low viscosity, flame retardant, waterproof, and excellent thermal shock resistance.
Can this compound be used in high temperature environments?
Yes, it has excellent performance in high temperature conditions, making it suitable for automotive and electronic applications.
Is VS-TP2001 Thermal Silicone Potting Compound suitable for outdoor applications?
Yes, it is moisture, dust, and shock resistant, making it suitable for outdoor environments.
VS-TP2001 Silicone Heat Conductive Potting Compound is designed for electronics protection. It provides excellent thermal conductivity for CPU and electronic devices. The silicone material ensures durability and flexibility in various applications. This product offers reliable performance for potting in sensitive electronic components.
The compound cures at room temperature or with heat. It is ideal for providing effective heat dissipation and moisture protection for electronic devices. Its low viscosity ensures smooth application in tight spaces and complex areas.
Item | Typical value | Test method |
Mixing ratio | 1:1 | / |
Color(After mixing) | Grey | Visual inspection |
Viscosity(Component A) @25℃ | 5500±500cps | ASTM D2196 |
Viscosity(Component B) @25℃ | 5500±500cps | ASTM D2196 |
Viscosity(After mixing) @25℃ | 5500±500cps | ASTM D2196 |
Opening hours@25℃ | ≥90min | / |
Curing condition | 30min/50℃；20min/100℃ | / |
Thermal conductivity | 2.0±0.2 W/m·k | ASTM D5470 |
Thermal resistance | 0.000815m2·k/W | ASTM D5470 |
hardness | 25±5 Shore A | GB/T 531.1-2008 |
density | 2.3±0.2 g/cm3 | GB/T 1033.1-2008 |
Tensile strength | ＞0.2 MPa | GB/T 528-2009 |
Elongation at break | ＞10% | GB/T 528-2009 |
Flame retardant rating | V-0 | UL94 |
Breakdown strength | ≥10 kV/mm | GB/T 1695-2005 |
Volume resistivity | ≥ 1.0×1014 Ω·cm | GB/T 1692-2008 |
Dielectric constant （1000Hz） | 4.7~5.5 | GB/T 1693-2007 |
Model | Packing |
VS-TP2001（1kg） | Component A 0.5kg; Component B 0.5kg |
VS-TP2001（20kg） | Component A 10kg; Component B 10kg |
VS-TP2001（40kg） | Component A 20kg; Component B 20kg |
VS-TP2001（80kg） | Component A 40kg; Component B 40kg |
VS-TP2001（100kg） | Component A 50kg; Component B 50kg |
Two-component system: This potting compound consists of two components that are mixed in a 1:1 ratio for easy use.
Room temperature or heat cure: Cures at room temperature or can be accelerated by heating for faster results.
High thermal conductivity: Designed to effectively dissipate heat and improve the performance of electronic devices.
Versatile protection: Provides protection for automotive components, providing physical strength and elasticity at high temperatures.
Excellent thermal shock resistance: Ensures reliable performance under extreme thermal cycling conditions.
Waterproof and flame retardant: Provides moisture protection and prevents fire, ensuring safety and durability.
Low viscosity: Allows easy application in small spaces and complex areas for precise potting.
Automotive Parts: For encapsulating automotive parts, providing physical protection and improving performance.
LED Lighting: Protects LED lighting modules, ensuring long-term reliability and heat dissipation.
Electronic Devices: Ideal for encapsulating sensitive electronic components, improving durability and stability.
Power Modules: For high-power power modules, ensuring safe and stable operation.
Inverters: Provides protective sealing for inverters, improving heat resistance and performance.
Sensors: Encapsulates sensors for enhanced protection from environmental factors.
What is the purpose of VS-TP2001 Thermal Silicone Potting Compound?
It is used to pot and protect electronic components such as automotive parts, LED lights, and other sensitive electronic devices.
What is the curing process of this potting compound?
The compound can be cured at room temperature or with heat. The higher the temperature, the shorter the curing time.
What are the main properties of the VS-TP2001 compound?
High thermal conductivity, low viscosity, flame retardant, waterproof, and excellent thermal shock resistance.
Can this compound be used in high temperature environments?
Yes, it has excellent performance in high temperature conditions, making it suitable for automotive and electronic applications.
Is VS-TP2001 Thermal Silicone Potting Compound suitable for outdoor applications?
Yes, it is moisture, dust, and shock resistant, making it suitable for outdoor environments.
