How Well Do You Know about Thermal Conductive Potting Compound?

With the rapid development of the electronic communication industry, people pay more and more attention to the stability and user experience of products, and have more stringent requirements for the long-term stability of electronic products. Therefore, more and more electronic products need to be potted. Thermal conductive potting compound can enhance the waterproof ability, shock resistance and heat dissipation performance of electronic products, protect them from the erosion of the natural environment, and extend their service life, making them more and more popular among engineers. Today we will introduce you to the common thermal conductive potting compound.

Thermal Conductive Silicone Potting Compound

Thermal conductive potting compound is liquid before curing and has fluidity. The viscosity of the potting compound varies according to the performance, material and production process of the product. The use value of thermal conductive electronic potting compound can only be realized after it is completely cured. After curing, it can play the role of waterproof and moisture-proof, heat conduction, confidentiality, corrosion resistance, dustproof, insulation, temperature resistance and shockproof. Silicone thermal conductive potting compound is a composite material prepared with silicone material as the matrix. It can be cured at room temperature or heated. It has the characteristics of faster curing at higher temperatures. It is made by adding thermal conductors to ordinary potting silicone or directly using silicone.

No by-products will be produced during the curing reaction. It can be applied to PC, PP, ABS, PVC and other materials and metal surfaces. It is suitable for thermal conductivity, insulation, waterproofing and flame retardancy of electronic accessories. Its flame retardancy can reach UL94 V-*0 level. It must comply with the requirements of the EU ROHS directive. The main application areas are the potting of electronic and electrical components and electrical assemblies, and it is also used in similar occasions such as temperature sensor potting.

The most common silicone thermal conductive potting compound is composed of two components (A and B components). The most common one is the addition type thermal conductive potting compound, it can be 

deeply potted and no low molecular weight substances are produced during the curing process, and the shrinkage rate is low. Silicone thermal conductive potting compound can obtain different thermal conductivity coefficients according to the addition of different thermal conductive powders. Ordinary ones can reach 0.6~2.0W/mK, and high thermal conductivity ones can reach more than 3.0W/mK. Generally, manufacturers can specially prepare according to needs.

As a silicone potting compound manufacturer, our company produces silicone thermal conductive potting compound with excellent high and low temperature resistance. It can withstand the cold and hot changes between -40℃~200℃ without cracking and maintain elasticity. After filling and modifying with thermal conductive materials, it still has good thermal conductivity. After potting, it can effectively improve the heat dissipation capacity and moisture resistance of electronic components. Moreover, the electronic potting glue made of silicone material is soft after curing, which is convenient for the maintenance of electronic equipment.

The color of thermal conductive silicone potting compound can generally be adjusted as needed, and it also performs very well in terms of shockproof performance and anti-aging performance.

Precautions for using silicone potting compound

1) According to the weight, mix and stir evenly at a ratio of A:B=11 before applying the potting compound. Please be noted that in order to ensure the good performance of the product, components A and B need to be fully stirred and mixed before 1:1 mixing, and then weighed and proportioned, and then the prepared potting compound is stirred evenly before applying and potting.

2) In addition to being related to the product formula, the operation time is also affected by temperature. High temperature will lead to faster curing speed and shortened operation time accordingly. Low temperature will slow down the curing speed and extend the operation time accordingly.

3) The fully mixed thermal conductive potting compound can be directly poured or poured into the container to be cured. It can be cured at room temperature or heated. If the gap for potting is narrow and the appearance of the product after potting and curing is required to be high, it can be vacuumed according to the situation, and the bubbles can be extracted before potting.

4) The two components should be stored separately and sealed, and mixed before use. The mixed rubber should be used up at one time to avoid waste.