Suzhou Volsun Electronics Technology Co., Ltd.
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VS-PU1001P
VOLSUN
In the realm of electronic component protection, where thermal management and environmental sealing are critical, the 2-Component Thermal PU Potting Compound emerges as a high-performance solution engineered to safeguard sensitive electronics in demanding applications. This advanced polyurethane formulation combines exceptional thermal conductivity with robust mechanical protection, creating a protective barrier that dissipates heat while shielding against moisture, dust, vibration, and chemical exposure. Its versatile curing properties and excellent adhesion to common substrates make it ideal for encapsulating everything from small sensors to large power electronics, ensuring reliable operation in automotive, industrial, and renewable energy systems.
Formulated with a proprietary blend of thermally conductive fillers, the potting compound achieves a thermal conductivity of 1.8 W/m·K, significantly outperforming standard potting materials (typically 0.2-0.5 W/m·K) . This high thermal efficiency facilitates effective heat transfer from electronic components to heat sinks or enclosures, reducing operating temperatures by up to 15°C in compact designs . The material maintains consistent thermal performance across its operating temperature range.
Upon curing, the compound forms a flexible yet durable elastomer with an IP68 ingress protection rating, completely sealing components from water, dust, and corrosive substances . Its low water absorption (<0.3% by weight) and resistance to automotive fluids, industrial chemicals, and UV radiation ensure long-term protection in harsh environments . The formulation meets UL 94 V-0 flammability standards, enhancing fire safety in electrical applications.
The two-component system features a 1:1 mix ratio by volume for easy dispensing and mixing, with a 30-minute working time at 25°C that allows ample time for complex encapsulations . It cures at room temperature to a Shore A 80 hardness in 24 hours or can be accelerated to full cure in 2 hours at 60°C . The compound adheres strongly to metals, plastics, ceramics, and PCBs without requiring primers, ensuring reliable bonding in diverse assemblies.
Category | Specification | Value | Test Method |
Thermal Properties | Thermal Conductivity | 1.8 W/m·K | ASTM D5470 |
Operating Temperature Range | -40°C to 120°C | ASTM D638 | |
Volume Resistivity | >10¹³ ohm·cm | IEC 60093 | |
Mechanical Properties | Hardness | 80 Shore A | ISO 868 |
Tensile Strength | 8.5 MPa | ASTM D638 | |
Elongation at Break | 120% | ASTM D638 | |
Processing Data | Mix Ratio (Volume) | 1:1 | Manufacturer Spec |
Working Time (25°C) | 30 minutes | ASTM D2471 | |
Full Cure Time (25°C) | 24 hours | ASTM D2471 | |
Accelerated Cure (60°C) | 2 hours | Manufacturer Test | |
Performance Metrics | Flammability Rating | UL 94 V-0 | UL 94 |
Water Absorption | <0.3% | ASTM D570 | |
Ingress Protection | IP68 | IEC 60529 |
Ideal for encapsulating ECUs, sensors, LED drivers, and battery management systems in electric and hybrid vehicles. Provides thermal management and protection against vibration, road salts, and temperature extremes.
Protects PLC modules, motor drives, and power supplies in manufacturing environments. Its chemical resistance ensures reliability in facilities using oils, coolants, and cleaning agents.
Essential for potting inverters, charge controllers, and junction boxes in solar panel arrays and wind turbines. Withstands outdoor exposure and thermal cycling while facilitating heat dissipation.
Safeguards sensitive components in power tools, home appliances, and outdoor electronics. Balances thermal performance with lightweight properties required for consumer products.
While epoxies offer higher rigidity, this PU compound provides superior flexibility and impact resistance, making it better suited for applications with vibration or thermal cycling . It offers comparable thermal conductivity to filled epoxies but with easier mixing (1:1 ratio) and faster room-temperature curing, reducing production time.
Yes, with a volume resistivity exceeding 10¹³ ohm·cm and excellent dielectric strength, the compound provides reliable insulation for components operating up to 1000V AC . It meets UL 94 V-0 flammability standards, making it suitable for high-voltage applications requiring fire safety compliance.
For small volumes, manual mixing with static mixers works effectively. For production environments, meter-mix dispensing systems with static mixing nozzles are recommended to ensure precise ratio control and thorough mixing . The 1:1 ratio simplifies equipment requirements compared to compounds with more complex mix ratios.
The compound cures reliably between 15°C and 35°C at room temperature, with colder temperatures extending cure time and warmer temperatures accelerating it . Once cured, it maintains performance from -40°C to 120°C, with no significant change in thermal conductivity or mechanical properties within this range, ensuring year-round reliability in outdoor applications.
In the realm of electronic component protection, where thermal management and environmental sealing are critical, the 2-Component Thermal PU Potting Compound emerges as a high-performance solution engineered to safeguard sensitive electronics in demanding applications. This advanced polyurethane formulation combines exceptional thermal conductivity with robust mechanical protection, creating a protective barrier that dissipates heat while shielding against moisture, dust, vibration, and chemical exposure. Its versatile curing properties and excellent adhesion to common substrates make it ideal for encapsulating everything from small sensors to large power electronics, ensuring reliable operation in automotive, industrial, and renewable energy systems.
Formulated with a proprietary blend of thermally conductive fillers, the potting compound achieves a thermal conductivity of 1.8 W/m·K, significantly outperforming standard potting materials (typically 0.2-0.5 W/m·K) . This high thermal efficiency facilitates effective heat transfer from electronic components to heat sinks or enclosures, reducing operating temperatures by up to 15°C in compact designs . The material maintains consistent thermal performance across its operating temperature range.
Upon curing, the compound forms a flexible yet durable elastomer with an IP68 ingress protection rating, completely sealing components from water, dust, and corrosive substances . Its low water absorption (<0.3% by weight) and resistance to automotive fluids, industrial chemicals, and UV radiation ensure long-term protection in harsh environments . The formulation meets UL 94 V-0 flammability standards, enhancing fire safety in electrical applications.
The two-component system features a 1:1 mix ratio by volume for easy dispensing and mixing, with a 30-minute working time at 25°C that allows ample time for complex encapsulations . It cures at room temperature to a Shore A 80 hardness in 24 hours or can be accelerated to full cure in 2 hours at 60°C . The compound adheres strongly to metals, plastics, ceramics, and PCBs without requiring primers, ensuring reliable bonding in diverse assemblies.
Category | Specification | Value | Test Method |
Thermal Properties | Thermal Conductivity | 1.8 W/m·K | ASTM D5470 |
Operating Temperature Range | -40°C to 120°C | ASTM D638 | |
Volume Resistivity | >10¹³ ohm·cm | IEC 60093 | |
Mechanical Properties | Hardness | 80 Shore A | ISO 868 |
Tensile Strength | 8.5 MPa | ASTM D638 | |
Elongation at Break | 120% | ASTM D638 | |
Processing Data | Mix Ratio (Volume) | 1:1 | Manufacturer Spec |
Working Time (25°C) | 30 minutes | ASTM D2471 | |
Full Cure Time (25°C) | 24 hours | ASTM D2471 | |
Accelerated Cure (60°C) | 2 hours | Manufacturer Test | |
Performance Metrics | Flammability Rating | UL 94 V-0 | UL 94 |
Water Absorption | <0.3% | ASTM D570 | |
Ingress Protection | IP68 | IEC 60529 |
Ideal for encapsulating ECUs, sensors, LED drivers, and battery management systems in electric and hybrid vehicles. Provides thermal management and protection against vibration, road salts, and temperature extremes.
Protects PLC modules, motor drives, and power supplies in manufacturing environments. Its chemical resistance ensures reliability in facilities using oils, coolants, and cleaning agents.
Essential for potting inverters, charge controllers, and junction boxes in solar panel arrays and wind turbines. Withstands outdoor exposure and thermal cycling while facilitating heat dissipation.
Safeguards sensitive components in power tools, home appliances, and outdoor electronics. Balances thermal performance with lightweight properties required for consumer products.
While epoxies offer higher rigidity, this PU compound provides superior flexibility and impact resistance, making it better suited for applications with vibration or thermal cycling . It offers comparable thermal conductivity to filled epoxies but with easier mixing (1:1 ratio) and faster room-temperature curing, reducing production time.
Yes, with a volume resistivity exceeding 10¹³ ohm·cm and excellent dielectric strength, the compound provides reliable insulation for components operating up to 1000V AC . It meets UL 94 V-0 flammability standards, making it suitable for high-voltage applications requiring fire safety compliance.
For small volumes, manual mixing with static mixers works effectively. For production environments, meter-mix dispensing systems with static mixing nozzles are recommended to ensure precise ratio control and thorough mixing . The 1:1 ratio simplifies equipment requirements compared to compounds with more complex mix ratios.
The compound cures reliably between 15°C and 35°C at room temperature, with colder temperatures extending cure time and warmer temperatures accelerating it . Once cured, it maintains performance from -40°C to 120°C, with no significant change in thermal conductivity or mechanical properties within this range, ensuring year-round reliability in outdoor applications.
