Suzhou Volsun Electronics Technology Co., Ltd.
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VS-TP1501
Volsun
VS-TP1501 silicone thermal conductive potting compound is a two-component 1:1 potting material designed for electronic and electrical applications requiring heat dissipation, electrical insulation and component protection. It offers a thermal conductivity of 1.5 W/m·K, helping transfer heat away from power electronics, PCB circuits and other heat-generating components.
The compound features low viscosity, good flowability and fast bubble release, allowing smooth filling into narrow gaps and complex structures. It can cure at room temperature or with mild heating to improve processing efficiency. After curing, VS-TP1501 provides stable protection for electronic components against moisture, dust, vibration and demanding operating conditions.
| Item | Value |
|---|---|
| Product Model | VS-TP1501 |
| Product Type | Two-component silicone thermal conductive potting compound |
| Mixing Ratio | 1:1 |
| Curing Method | Room temperature curing or heat curing |
| Thermal Conductivity | 1.5 W/m·K |
| Operating Temperature | -40°C to 200°C |
| Hardness | 80 Shore00 |
| Tensile Strength | 0.2 MPa |
| Flow Property | Low viscosity, self-leveling |
| Environmental Compliance | RoHS certified |
| Available Colors | White, black and gray |
| Packaging | 1 kg / 20 kg / 40 kg / 80 kg / 100 kg kits |
Two-component 1:1 system: Easy to mix and apply with equal Component A and Component B ratio.
Thermal conductivity: Provides 1.5 W/m·K thermal conductivity to help dissipate heat from electronic components.
Electrical insulation: Helps protect electronic and electrical assemblies while supporting safe circuit operation.
Low viscosity: Flows easily into small gaps for efficient potting and encapsulation.
Self-leveling performance: Helps create smooth coverage around components and complex structures.
Fast bubble release: Supports better filling performance and improved potting quality.
Flexible curing options: Cures at room temperature or with mild heating to improve processing efficiency.
High-temperature resistance: Suitable for applications with an operating temperature range from -40°C to 200°C.
RoHS certified: Meets RoHS environmental requirements.
Multiple color options: Available in white, black and gray for different project needs.
VS-TP1501 is designed for potting, encapsulation, thermal management and protection of electronic and electrical components.
Typical applications include:
Potting protection of power modules
Thermal potting for inverters and converters
Encapsulation of ballasts and electronic control units
Protection of LED lighting components
Potting and protection of electronic sensors
Heat dissipation protection for PCB circuits
Encapsulation of electronic products requiring thermal conductivity and electrical insulation
| Property | Typical Value |
|---|---|
| Mixing Ratio | 1:1 |
| Thermal Conductivity | 1.5 W/m·K |
| Operating Temperature | -40°C to 200°C |
| Hardness | 80 Shore00 |
| Tensile Strength | 0.2 MPa |
| Curing Method | Room temperature curing or mild heat curing |
| Flow Property | Low viscosity, self-leveling |
| Color Options | White, black and gray |
Type | Package |
VS-TP1501（1kg） | Component A 0.5kg; Component B 0.5kg |
VS-TP1501（20kg） | Component A 10kg; Component B 10kg |
VS-TP1501（40kg） | Component A 20kg; Component B 20kg |
VS-TP1501（80kg） | Component A 40kg; Component B 40kg |
VS-TP1501（100kg） | Component A 50kg; Component B 50kg |
Stir Component A and Component B separately before mixing to ensure uniform material consistency.
Mix Component A and Component B at a 1:1 ratio.
Stir thoroughly until the mixed compound is uniform.
Pour the mixed compound into the electronic module, cavity or area to be potted.
Allow the material to flow and self-level around the target components.
Cure the compound at room temperature or use mild heating to accelerate the curing process.
Make sure the potted area is fully cured before handling or final assembly.
VS-TP1501 combines thermal conductivity, electrical insulation and protective encapsulation in one silicone potting material. Its two-component 1:1 mixing system is easy to process, while its low viscosity and self-leveling performance help the compound flow into small gaps and cover complex component structures. With 1.5 W/m·K thermal conductivity and an operating temperature range from -40°C to 200°C, it is suitable for electronic modules that require stable heat dissipation and long-term protection.
A1: The curing process can be carried out at room temperature, but heating can speed up the curing time.
A2: VS-TP1501 is ideal for potting power modules, inverters, ballasts, LED lighting components, and electronic sensors.
A3: Yes, it is suitable for high temperature applications with a temperature range of -40°C to 200°C.
A4: Yes, it provides excellent electrical insulation and protects components from moisture, dust, and vibration.
A5: The thermal conductivity of VS-TP1501 is 1.5W/mK, ensuring effective heat dissipation.
A6: VS-TP1501 is available in white, black and gray to meet different project requirements.
A7: VS-TP1501 is available in 1 kg, 20 kg, 40 kg, 80 kg and 100 kg kits.
A8: Yes. After curing, VS-TP1501 helps protect electronic components from moisture, dust, vibration and demanding operating conditions.
