Innovative Thermal Technology - Volsun VS-GP2001-SI Silicone Thermal Pad

In today's era of highly integrated electronic devices, heat dissipation efficiency has become a key bottleneck restricting product performance and life. The continuous operation of high-power devices generates a lot of heat. If it cannot be effectively and timely discharged, it will cause the equipment to overheat and shorten its service life. Therefore, it is crucial to choose a thermally conductive material with excellent performance.

Volsun, as a high-tech enterprise that has been deeply involved in the field of polymer materials for many years, has always been committed to providing innovative material solutions to global customers. The VS-GP2001-SI silicone thermal pad we produce is a thermal conductive material designed for high-power devices. With its excellent thermal conductivity, stable reliability and flexible adaptability, it provides efficient and reliable heat dissipation solutions for new energy vehicles, electronic power, industrial equipment and other fields, leading the industry into a new era of efficient heat dissipation.

The core advantage of the VS-GP2001-SI thermal pad is that it can effectively solve the heat dissipation problem of high-power devices. It can achieve extremely low interfacial thermal resistance under low pressure environment, just like building an efficient heat conduction bridge between the heating element and the radiator, effectively filling the tiny air gap between the power device and the heat sink aluminum sheet and the machine casing, thereby greatly improving the heat conduction efficiency and ensuring the stable operation of the equipment.

The excellent performance of this thermal pad comes from its four core advantages:

1. The VS-GP2001-SI thermal pad can work stably in the extreme temperature range of -40℃ to +200℃. It has excellent thermal stability and anti-aging properties. Even in high temperature, high humidity or severe cold environment, it can maintain softness and resilience. It will not harden or become brittle after long-term use, ensuring the consistent thermal conductivity.

2. With a thermal conductivity of up to 2.0 W/m·k and an oil permeation rate as low as ≤2%, VS-GP2001-SI can effectively avoid oil pollution of devices while efficiently conducting heat, reducing contact thermal resistance from the source. This makes it an ideal choice for high-heat devices such as high-density integrated circuits and power modules.

3. The VS-GP2001-SI thermal pad has excellent flexibility, a hardness range of 30-70 Shore OO, and an optional thickness of 0.5~5.0mm. It can be flexibly customized according to the gap and pressure requirements of different devices. Its surface wettability is excellent, and it can fit tightly to irregular interfaces without high pressure, improving production efficiency.

4. The VS-GP2001-SI thermal pad complies with RoHS and REACH environmental standards, does not contain harmful substances such as lead and cadmium, and is environmentally friendly. At the same time, its flame retardant grade reaches UL94 V-0, it is difficult to burn in the event of open flames and does not drip, meeting the strict safety requirements of electronic equipment.

Volsun always adheres to quality as the core, and strictly controls the entire process from material research and development to production technology. The VS-GP2001-SI thermal pad has passed the ISO 9001 quality management system certification, meets international testing standards, and its quality is trustworthy. Choosing Volsun VS-GP2001-SI silicone thermal pad means choosing an efficient, stable and reliable heat dissipation solution.