Volsun Silicone Thermal Conductive Products Series

In the heat dissipation solutions of modern electronic equipment, Volsun silicone series products - thermally conductive silicone pads and thermally conductive gap filler gels are widely used due to their excellent performance. Both products have efficient thermal conductivity properties, which can significantly improve heat dissipation efficiency and reduce the operating temperature of the device, thereby improving performance and extending service life.

Silicone thermal conductive pad

You can also call it as thermal conductive silicone pad, it is a polymer material with high thermal conductivity. It is not only easy to shape and adapt to different shapes of products and structures, but also maintains stability in extreme high temperature environments. The thermal resistance of the thermally conductive silicone pad is very low, which can effectively reduce the operating temperature of the product. It has good elasticity and can adapt to different stress states. In addition, it is corrosion-resistant and can resist chemical corrosion and increase the service life of the product.

The five major characteristics of thermally conductive silicone pads include convenience, high thermal conductivity, stability, insulation and sound absorption and shock absorption effect. These characteristics make it widely used in cooling modules of electronic products, CPUs and other high-power components. For example, in the field of LED lighting, thermally conductive silicone pads can effectively dissipate the heat generated by LED lights quickly, ensuring the normal brightness and life of the lamps.

Silicone thermal conductive gap filler gel

Thermal conductive gap filler gel is a soft silicone-based thermal gap filling material with high thermal conductivity, low interface thermal resistance and good thixotropy. It is especially suitable for applications with large gap tolerances. Thermal conductive gap filler gel inherits the advantages of silicone materials such as good affinity, weather resistance, high and low temperature resistance, and insulation. At the same time, it has strong plasticity and can fill uneven interfaces and meet the heat transfer needs of various applications.

Thermal conductive gap filler gel consists of thermally conductive fillers, matrix materials and additives that work together to enable it to significantly increase the efficiency of heat transfer from the heat source to the heat sink by filling the tiny gaps between the electronic components and the heat sink. The application fields of thermal conductive gap filler gel are very wide, including computers and servers, circuit boards, communication equipment, LED lighting, automotive electronics, medical electronics, household appliances, instrumentation, electrical and electronics, new energy and security equipment, etc.

With the continuous improvement of the performance of electronic equipment and the growth of market demand, thermally conductive silicone pads and thermal conductive gap filler gels are expected to play a more important role in the field of thermal management materials in the future due to their unique advantages.

Volsun will continue to explore the field of thermal conductive products and devote itself to the development of the industry.