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Two-Component Potting for PCB Boards

VS-TP1001 is a two-component 1:1 mixing ratio heat-curing silicone thermal potting compound that can be cured at room temperature or under heating conditions to create a highly elastic thermally conductive silicone rubber. 
This product is tailored for the production of electronic and electrical products and modules, such as the potting protection of high-power power modules and other equipment, as well as a stable connection between automotive electronic components and printed circuit boards (PCBs).
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  • VS-TP1001

  • VOLSUN

As an innovative manufacturer of electronic protection materials, VOLSUN introduces the VS-TP1001 two component silicone potting compound, a 1:1 mix ratio heat-curable formulation purpose-built for potting and protection of printed circuit board (PCB) assemblies. Developed for electronic and electrical product manufacturing enterprises, this high-elasticity thermally conductive silicone rubber is engineered to deliver stable thermal management, insulation protection, and mechanical reinforcement for PCB boards and their mounted components. It supports both room temperature and accelerated heat curing, making it a versatile solution for high-volume PCB production lines and custom electronic module manufacturing.

Two-Component Potting for PCB Boards

Key Features & Industrial-Grade Benefits

Superior PCB-Specific Insulation & Protection

At the core of the VS-TP1001 thermal conductive potting compound for PCB is its exceptional electrical insulation performance, with a breakdown strength of ≥15 kV/mm, volume resistivity ≥1.0×10¹⁴ Ω·cm, and a dielectric constant of 3.9~4.6 at 1000Hz. This creates a reliable insulating barrier for PCB traces, solder joints, and sensitive surface-mount components, preventing short circuits, electrostatic damage, and signal interference. Its UL94 V-0 flame retardant rating ensures strict compliance with global electronic safety standards, reducing regulatory compliance burdens for manufacturing clients.

Optimized Formulation for High-Volume PCB Production

This silicone liquid potting materials for electronics features a balanced 1:1 mix ratio (by weight or volume) and a controlled 2500±500 cps viscosity at 25℃, ensuring excellent flowability to fully encapsulate complex PCB layouts, tight component gaps, and through-hole structures without trapping air bubbles. Its ≥60-minute open time at 25℃ provides sufficient operational flexibility for batch processing, while fast curing (30 minutes at 50℃, 20 minutes at 100℃) supports high-throughput production lines, reducing cycle times and improving overall manufacturing efficiency.

Durable Mechanical & Environmental Stability

With a 65±5 Shore A hardness, the cured VS-TP1001 potting compounds for electronic component delivers robust mechanical reinforcement for PCB assemblies, absorbing vibration, shock, and thermal expansion mismatches between components and PCB substrates. It offers excellent moisture, dust, and chemical corrosion resistance, protecting PCB boards from harsh operating environments such as industrial automation, outdoor electronics, and automotive under-hood applications. Its 1.0±0.2 W/m·k thermal conductivity effectively dissipates localized heat from PCB-mounted components, preventing hot spot formation and extending the service life of electronic assemblies.

Technical Specifications

Item

Typical value

Test method

Mixing ratio

1:1

/

Color(After mixing)

Grey

Visual inspection

Viscosity(Component A) @25℃

2500±500cps

ASTM D2196

Viscosity(Component B) @25℃

2500±500cps

ASTM D2196

Viscosity(After mixing) @25℃

2500±500cps

ASTM D2196

Opening hours@25℃

≥60min

/

Curing condition

30min/50℃;20min/100℃

/

Thermal conductivity

1.0±0.2 W/m·k

ASTM D5470

Thermal resistance

0.000815m2·k/W

ASTM D5470

hardness

65±5 Shore A

GB/T 531.1-2008

density

2.0±0.2 g/cm3

GB/T 1033.1-2008

Tensile strength

>0.5 MPa

GB/T 528-2009

Elongation at break

>10%

GB/T 528-2009

Flame retardant rating

V-0

UL94

Breakdown strength

≥15 kV/mm

GB/T 1695-2005

Volume resistivity

≥ 1.0×1014 Ω·cm

GB/T 1692-2008

Dielectric constant (1000Hz)

3.9~4.6

GB/T 1693-2007

Typical Applications & Industry Solutions

The VS-TP1001 two component silicone potting compound provides targeted PCB protection solutions for industrial manufacturing clients across key sectors:

Automotive PCB Control Units: Encapsulation of automotive body control modules, engine control PCBs, and on-board diagnostic systems, ensuring stable performance under vibration, temperature cycling, and under-hood chemical exposure.

Industrial Power Supply PCB Modules: Potting of AC/DC converter PCBs, power regulator boards, and industrial power supply assemblies, delivering insulation protection and thermal management for continuous high-load operation.

Consumer Electronics PCB Assemblies: Protection of smart home device PCBs, wearable electronics control boards, and household appliance circuit boards, improving product durability and reducing after-sales failure rates.

Communication & Sensor PCBs: Environmental sealing of wireless communication module PCBs, industrial sensor circuit boards, and IoT device control boards, safeguarding against moisture and dust in outdoor and industrial environments.

Customization & Flexible Supply Solutions

VOLSUN partners with electronic manufacturing enterprises to deliver customized thermal conductive potting compound for PCB solutions that meet unique production and application needs. We offer formulation adjustments including modified viscosity, curing speed, thermal conductivity, and color, as well as custom packaging sizes to match manual, semi-automated, and fully automated production processes. Our flexible supply chain supports both prototype small-batch orders and large-scale bulk shipments, with reliable lead times and global delivery to support manufacturing operations worldwide.

FAQs

What pre-treatment is required before potting PCB boards?

Ensure PCB boards are free of large debris, oil, and contaminants to maintain optimal adhesion of the potting compound. For high-reliability applications, a cleaning and drying process is recommended prior to potting.

Can this compound be cured at room temperature?

Yes. The VS-TP1001 two component silicone potting compound can fully cure at room temperature, with curing time varying based on ambient temperature. Low-temperature environments will extend the full curing duration.

Is this formulation compatible with common PCB substrates?

Yes. It is compatible with FR-4, aluminum-based, and flexible PCB substrates, as well as most common electronic component materials, with no corrosion or adverse effects on solder joints and component pins.


How to use silicone potting compound?


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