Suzhou Volsun Electronics Technology Co., Ltd.
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VS-TP2001
Volsun
As a trusted manufacturer of high-performance thermal management materials, VOLSUN presents the VS-TP2001 low viscosity high thermal conductive silicone potting compound, a two-component 1:1 mix ratio formulation engineered for reliable thermal potting for electronic modules. Designed to meet the rigorous demands of industrial manufacturing clients, this silicone-based encapsulant delivers exceptional heat dissipation, environmental protection, and mechanical stability for sensitive electronic assemblies. It cures efficiently at room temperature or via accelerated heat curing, forming a flexible thermally conductive silicone rubber that adapts to complex component geometries, making it an ideal solution for enterprise-level manufacturers seeking consistent, high-yield potting solutions.
At the core of the VS-TP2001 thermal conductive silicone potting compound is its industry-leading thermal conductivity of 2.0±0.2 W/m·k, tested to ASTM D5470 standards. This high thermal performance rapidly dissipates heat from high-power electronic components, minimizing thermal stress, reducing premature failure risks, and extending end-product service life. With an ultra-low thermal resistance of 0.000815 m²·k/W, it creates a seamless thermal path between components and heat sinks, delivering consistent performance even under continuous high-load operation.
This silicone potting compound features a balanced 1:1 mix ratio and uniform 5500±500 cps viscosity at 25℃, ensuring easy handling and compatibility with both manual and automated dispensing systems. Its ≥90-minute open time at 25℃ provides ample operational window for complex potting processes, reducing material waste and improving production efficiency. Full curing is completed in 30 minutes at 50℃ or 20 minutes at 100℃, enabling flexible production scheduling and faster time-to-market for industrial clients.
The VS-TP2001 flame resistant potting compound achieves a UL94 V-0 flame retardant rating, paired with ≥10 kV/mm dielectric strength, ≥1.0×10¹⁴ Ω·cm volume resistivity, and outstanding thermal shock resistance. It delivers reliable waterproof, dustproof, and vibration-resistant performance, safeguarding components against harsh industrial, outdoor, and automotive operating environments. With a 25±5 Shore A hardness, it maintains flexibility to absorb mechanical stress and thermal expansion mismatches, eliminating component damage during temperature cycling.
Item | Typical value | Test method |
Mixing ratio | 1:1 | / |
Color(After mixing) | Grey | Visual inspection |
Viscosity(Component A) @25℃ | 5500±500cps | ASTM D2196 |
Viscosity(Component B) @25℃ | 5500±500cps | ASTM D2196 |
Viscosity(After mixing) @25℃ | 5500±500cps | ASTM D2196 |
Opening hours@25℃ | ≥90min | / |
Curing condition | 30min/50℃；20min/100℃ | / |
Thermal conductivity | 2.0±0.2 W/m·k | ASTM D5470 |
Thermal resistance | 0.000815m2·k/W | ASTM D5470 |
hardness | 25±5 Shore A | GB/T 531.1-2008 |
density | 2.3±0.2 g/cm3 | GB/T 1033.1-2008 |
Tensile strength | ＞0.2 MPa | GB/T 528-2009 |
Elongation at break | ＞10% | GB/T 528-2009 |
Flame retardant rating | V-0 | UL94 |
Breakdown strength | ≥10 kV/mm | GB/T 1695-2005 |
Volume resistivity | ≥ 1.0×1014 Ω·cm | GB/T 1692-2008 |
Dielectric constant （1000Hz） | 4.7~5.5 | GB/T 1693-2007 |
The VS-TP2001 silicone potting compound for electronics delivers targeted solutions for industrial manufacturers across high-demand sectors:
Automotive Electronics: Encapsulation of on-board chargers and power distribution units, providing thermal stability and mechanical protection against vehicle vibration and extreme temperature fluctuations.
LED Lighting Systems: Potting of high-brightness LED modules and street lighting assemblies, ensuring consistent heat dissipation to maintain lumen output and extend product lifespan.
High-Power Modules: Thermal encapsulation of inverters and frequency converters, delivering reliable heat management for continuous high-load operation in industrial equipment.
Industrial Sensors: Environmental sealing of precision sensors for automation and energy systems, safeguarding sensitive circuitry against moisture, dust, and chemical exposure.
VOLSUN works closely with industrial partners to deliver tailored thermal conductive silicone potting compound solutions aligned with unique production requirements. We offer customizable formulation adjustments, including modified viscosity, curing speed, thermal conductivity, and color options, to match specific dispensing processes. Our flexible supply chain supports both small-batch prototype runs and large-volume bulk orders, with reliable lead times and global delivery capabilities to support worldwide manufacturing operations.
Stir Component A and Component B separately before blending to ensure uniform filler distribution, then mix the two components at a 1:1 ratio by weight or volume. Vacuum defoaming is recommended before pouring to maximize thermal performance.
Yes. The VS-TP2001 silicone potting compound offers excellent moisture, dust, and UV resistance, making it suitable for long-term outdoor use in harsh environmental conditions.
Absolutely. Its stable viscosity, 1:1 mix ratio, and long open time make it fully compatible with most automated dispensing and potting systems used in high-volume industrial production.
