Suzhou Volsun Electronics Technology Co., Ltd.
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VS-PU1001P
VOLSUN
VS-PU1001P is a two-component room temperature curable polyurethane thermal potting-sealing adhesive with good insulation, moisture proof, sealing and bonding properties, which is used in the manufacture of electronic and electrical products and modules, such as the potting-sealing protection of high-power power modules, frequency converters, sensors, etc., and the connection fixation between vehicle electronic devices and PCB.
Components A and B are stirred separately
The stirred components A and B shall be mixed evenly at the ratio of 5:1 (either volume ratio/weight ratio can be used)
To ensure the uniform distribution of fillers, component A and component B must be separately stirred before mixing, and vacuumed for 3-10min after mixing
The mixed adhesive is poured into the device to be filled and cured
In order to ensure the uniform distribution of fillers, component A and component B must be separately stirred before mixing, so that each compound is evenly mixed
A and B agents will react and cure each other after mixing, so they need to be used after mixing, and can not be used twice after mixing and curing
When pouring into the protective part, there should be no large debris or other pollutants in the protective part to avoid affecting the adhesion of materials and objects
Before the material is fully cured, keep other objects away from the material, which may affect the appearance and protective performance of the material
Keep this product away from the mouth and eyes. If it enters the mouth and eyes accidentally, rinse it with clean water or go to the hospital
For high thermal conductivity, vacuum defoaming is required prior to perfusion
Products should be stored in the original packaging sealed storage, avoid contamination (temperature: 15℃ < T < 30℃; Dry storage)
The shelf life is 6 months from the production date
VS-PU1001P is a two-component room temperature curable polyurethane thermal potting-sealing adhesive with good insulation, moisture proof, sealing and bonding properties, which is used in the manufacture of electronic and electrical products and modules, such as the potting-sealing protection of high-power power modules, frequency converters, sensors, etc., and the connection fixation between vehicle electronic devices and PCB.
Components A and B are stirred separately
The stirred components A and B shall be mixed evenly at the ratio of 5:1 (either volume ratio/weight ratio can be used)
To ensure the uniform distribution of fillers, component A and component B must be separately stirred before mixing, and vacuumed for 3-10min after mixing
The mixed adhesive is poured into the device to be filled and cured
In order to ensure the uniform distribution of fillers, component A and component B must be separately stirred before mixing, so that each compound is evenly mixed
A and B agents will react and cure each other after mixing, so they need to be used after mixing, and can not be used twice after mixing and curing
When pouring into the protective part, there should be no large debris or other pollutants in the protective part to avoid affecting the adhesion of materials and objects
Before the material is fully cured, keep other objects away from the material, which may affect the appearance and protective performance of the material
Keep this product away from the mouth and eyes. If it enters the mouth and eyes accidentally, rinse it with clean water or go to the hospital
For high thermal conductivity, vacuum defoaming is required prior to perfusion
Products should be stored in the original packaging sealed storage, avoid contamination (temperature: 15℃ < T < 30℃; Dry storage)
The shelf life is 6 months from the production date
